JPH0751320Y2 - Ledプリンタヘッド - Google Patents
LedプリンタヘッドInfo
- Publication number
- JPH0751320Y2 JPH0751320Y2 JP1988162538U JP16253888U JPH0751320Y2 JP H0751320 Y2 JPH0751320 Y2 JP H0751320Y2 JP 1988162538 U JP1988162538 U JP 1988162538U JP 16253888 U JP16253888 U JP 16253888U JP H0751320 Y2 JPH0751320 Y2 JP H0751320Y2
- Authority
- JP
- Japan
- Prior art keywords
- bonding wire
- led
- light
- led chip
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000006096 absorbing agent Substances 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988162538U JPH0751320Y2 (ja) | 1988-12-15 | 1988-12-15 | Ledプリンタヘッド |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988162538U JPH0751320Y2 (ja) | 1988-12-15 | 1988-12-15 | Ledプリンタヘッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0282541U JPH0282541U (en]) | 1990-06-26 |
JPH0751320Y2 true JPH0751320Y2 (ja) | 1995-11-22 |
Family
ID=31446455
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988162538U Expired - Lifetime JPH0751320Y2 (ja) | 1988-12-15 | 1988-12-15 | Ledプリンタヘッド |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0751320Y2 (en]) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101443925B (zh) * | 2006-04-04 | 2012-02-22 | 富士施乐株式会社 | 带有微透镜的发光元件阵列以及光写入头 |
JP4255480B2 (ja) * | 2006-04-26 | 2009-04-15 | 株式会社沖データ | 半導体複合装置、ledヘッド、及び画像形成装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59196272A (ja) * | 1983-04-22 | 1984-11-07 | Ricoh Co Ltd | 光書込みヘツド |
-
1988
- 1988-12-15 JP JP1988162538U patent/JPH0751320Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0282541U (en]) | 1990-06-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6476551B1 (en) | LED array head and minute reflection optical elements array for use in the LED array head | |
US6252252B1 (en) | Optical semiconductor device and optical semiconductor module equipped with the same | |
JP3572924B2 (ja) | 発光装置及びそれを用いた記録装置 | |
US4630180A (en) | Light emitting diode array | |
US20060124946A1 (en) | Optical transmitter | |
EP0484887B1 (en) | Laser diode device having a protective layer on its light-emitting end face | |
JP2005234464A (ja) | 光トランシーバ及びこれに用いる光モジュール | |
US5490158A (en) | Laser unit | |
JPH0751320Y2 (ja) | Ledプリンタヘッド | |
JP3560712B2 (ja) | 光プリントヘッド | |
JPH0538845A (ja) | 発光ダイオードアレイプリンタヘツド | |
CN210109315U (zh) | 一种激光雷达散热装置 | |
US5285217A (en) | Led exposure head | |
JPH085814Y2 (ja) | Ledプリンタヘッド | |
JPS6039880A (ja) | 発光装置 | |
CN211123252U (zh) | 一种激光雷达散热装置 | |
JPH1084122A (ja) | 受光装置 | |
JP3113392B2 (ja) | 完全密着型イメージセンサ | |
JP2738347B2 (ja) | 半導体レーザ装置 | |
JPH08256296A (ja) | ビデオカメラ | |
JP2912560B2 (ja) | 光ピックアップ | |
JP3865852B2 (ja) | 光検出装置 | |
JP2927619B2 (ja) | 光プリントヘッド | |
JP2974185B2 (ja) | 固体撮像装置 | |
JPH11307808A (ja) | ホトカプラ装置 |